Proveedor de equipos para semiconductores | Máquinas de soldadura de alambre

Semiconductor Manufacturing & Packaging Equipment

HYRNUS provides semiconductor manufacturing, packaging and testing equipment for research, pilot production and mass-production applications. Our equipment portfolio covers multiple processes from wafer preparation and die attachment to wire bonding, molding, inspection, testing and final sorting.

Máquina de unión de bolas con alambre de oro
La máquina de soldadura de hilo con bola de oro HY-GB2012 se utiliza principalmente para la soldadura interna de terminales de LED de alta potencia, diodos láser, diodos de baja y media potencia, transistores, circuitos integrados, sensores y dispositivos semiconductores especiales. Es especialmente adecuada para la soldadura de hilos en dispositivos LED de alta potencia.
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Máquina de soldadura de cables ultrasónica para laboratorio
La máquina de soldadura ultrasónica HY-WB2000 utiliza hilo de aluminio fino, presión y energía ultrasónica para crear conexiones eléctricas fiables entre chips y sustratos. Es adecuada para dispositivos de microondas, módulos de radiofrecuencia, circuitos híbridos, MEMS, dispositivos optoelectrónicos, sensores, dispositivos semiconductores, dispositivos de radar, encapsulados COB/SOB y otras aplicaciones microelectrónicas.
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One-Stop Semiconductor Equipment Solutions

In addition to standalone semiconductor equipment, HYRNUS provides equipment configuration and integrated production line solutions for semiconductor manufacturing and electronic component packaging.

Get A custom solution

01 Production Line Planning

Plan the production process, equipment layout, material flow and workstation configuration based on the available factory space, target capacity and automation requirements.

02 Process Solution Development

Develop a suitable process flow according to the device type, package structure, materials and manufacturing requirements, covering key processes such as die attach, wire bonding, molding, inspection, testing and sorting.

03 Equipment Selection and Configuration

Select and configure suitable machines based on production capacity, material compatibility, positioning accuracy, process control, automation level and data traceability requirements.

Semiconductor packaging production line

Productos

01

Production Line Planning

02

Process Solution Development

03

Equipment Selection and Configuration